Appeal No. 1998-2159 Page 2
Application No. 08/539,892
The appellants' invention relates to a process of bonding
a nozzle plate to a surface of a semiconductor chip. A copy
of the claims under appeal is set forth in the appendix to the
appellants' brief.
The prior art references of record relied upon by the
examiner in rejecting the appealed claims are:
Schantz et al. 5,408,738 Apr.
25, 1995
(Schantz)
Takatsu 1 JP 57-70612 May 1, 1982
Claims 1 to 4 stand rejected under 35 U.S.C. § 103 as
being unpatentable over Schantz in view of Takatsu.
Rather than reiterate the conflicting viewpoints advanced
by the examiner and the appellants regarding the above-noted
rejection, we make reference to the final rejection (Paper No.
6, mailed September 5, 1997) and the answer (Paper No. 10,
1In determining the teachings of Takatsu, we will rely on
the translation of record provided by the USPTO.
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