Appeal No.1998-2486
Application No. 08/751,375
system. More specifically, the electronic subassembly comprises a compressible shock
absorbing material so that in an uncompressed state, the shock absorbing material,
together with the subassembly, has a greater external dimension than a form factor defined
by the aperture, while in a compressed state, the shock absorbing material, together with
the subassembly, has an exterior dimension which conforms to the form factor so that the
electronic subassembly, with the shock absorbing material thereon, fits properly within the
aperture.
Representative independent claim 16 is reproduced as follows:
16. A method of manufacturing a removable electronic subassembly for
placement into a data processing system which requires said removable
electronic subassembly to fit into an aperture defining a selected form factor,
the method comprising the steps of:
enclosing interior components of said removable electronic
subassembly within a rigid enclosure having exterior dimensions which are
smaller than said selected form factor; and
mounting a layer of resilient material onto at least a portion of said
rigid enclosure so that said layer of resilient material and said rigid
enclosure have at least one exterior dimension substantially exceeding said
selected form factor in an uncompressed state, wherein said resilient
material may be substantially compressed such that said at least one
exterior dimension conforms to said selected form factor.
The examiner relies on the following reference:
Morehouse et al. (Morehouse) 5,161,770 Nov. 10, 1992
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