Ex parte BLANCHARD - Page 3




          Appeal No. 1998-2897                                                        
          Application No. 08/749,381                                                  


               The disclosed invention relates to an integrated active                
          antenna structure in which a semiconductor integrated circuit               
          chip is physically mounted on an interior wall of a cavity in               
          the antenna.  The chip is encapsulated in the cavity by an                  
          encapsulating material.  Leads are electrically connected to                
          the chip, and they extend through the cavity and the                        
          encapsulating material to the outside of the antenna.  The                  
          leads are insulated from the antenna.                                       
               Claim 1 is illustrative of the claimed invention, and it               
          reads as follows:                                                           
               1.  An integrated active antenna structure, comprising:                
               an antenna which operates at an RF operating                           
          frequency,     said antenna having walls defining a cavity, an              
          opening             leading to said cavity, and an interior                 
          mounting surface       within said cavity;                                  
               a semiconductor integrated circuit chip which is                       
                    physically mounted on the interior mounting surface               
          of said antenna, and which is connected to apply an RF drive                
          signal    to said antenna, the dimensions of said chip being                
          small     enough to permit installation thereof within said                 
          cavity by      passing said chip through said opening;                      
               material encapsulating said chip within said cavity;                   
          and       leads insulated from said antenna and electrically                
          connected      to said chip within said cavity, said leads                  
          extending           outside said cavity through said opening to             
          provide external    electrical connection to said chip.                     


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