Appeal No. 1998-3033
Application No. 08/794,982
composition . . . comprising a composition of pure metal and a
portion of said solder.” When the solder ball 40 and the thin
solder layer 50 on device 10 in Noll are secured to conductive
pads 64 on substrate 68, “[t]he solder mass 40 is not affected
by this soldering operation” (column 3, lines 40 and 41).
Thus, the 35 U.S.C. § 102(b) rejection of claims 23 through
30, 32, 33 and 36 is reversed because Noll does not form a
eutectic composition comprising a pure metal and a portion of
solder ball 40. The 35 U.S.C. § 102(b)/35 U.S.C. § 103(a)
rejections of claims 38 and 39 are reversed for the same
reason.
The 35 U.S.C. § 103(a) rejection of claims 31, 34, 35 and 37
is reversed because Best does not cure the noted shortcoming
in the teachings of Noll.
DECISION
With the exception of the indefiniteness rejection of
claim 24, all of the rejections are reversed. Accordingly,
the decision of the examiner is affirmed-in-part.
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