Appeal No. 2000-0628
Application No. 08/838,536
The disclosed invention relates to an interconnection
between two separate integrated circuit (IC) chips on a multi-
chip module.
Claims 1 and 22 are illustrative of the claimed
invention, and they read as follows:
1. A multi-chip module (MCM), comprising:
a substrate for supporting a plurality of separate
integrated circuit (IC) chips thereon;
first and second separate IC chips mounted on said
substrate, said first separate IC chip comprising a first
circuit portion coupled to a multiplexing circuit and a
buffer by at least one signal conductor; and
interconnecting means that directly couples said at
least one signal conductor of said first separate IC chip
to said second separate IC chip thereby bypassing said
multiplexing circuit and said buffer.
22. A multi-chip module (MCM) comprising:
a first chip having a first conductive path coupled
to a second conductive path through a first circuit
portion, said second conductive path providing an
external electrical coupling for said first chip;
a second chip having a third conductive path, said
first chip separate from said second chip;
a substrate, said first chip and said second chip
mounted on said substrate; and
an interconnection between said first conductive path
and said third conductive path, said interconnection
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