Appeal No. 2000-1517
Application 08/850,470
The invention relates to an electronic and/or optical
package assembly which is defined in representative claim 1 as
follows:
1. A package assembly comprising an electronic and/or an
optical component mounted on a circuit board, both said
circuit board and said electronic and/or optical component
being sealed to a housing, said housing having a hole
therethrough to provide access to said electronic and/or
optical component and being filled with an organic polymer
encapsulating material that is cured in place, said electronic
and/or optical component being sealed to said housing around
said access hole by sealing material surrounding said access
hole to prevent flow of said encapsulating material
therethrough during curing thereof, the improvement comprising
an integral sealing member having an aperture therethrough in
alignment with said access hole to seal said electronic and/or
optical component to said housing, said integral sealing
member exhibiting the following mechanical, physical, and
thermal characteristics:
(a) it can withstand temperatures ranging from -65 C up to "
155 C;"
(b) it can be readily die cut, punched, or otherwise
shaped;
(c) it exhibits low durometer/low shear stress;
(d) it exhibits adhesive tack at ambient temperature;
(e) it maintains sufficient fluid resistance during the
curing procedure for said encapsulating material to prevent
leakage of said encapsulating material; and
(f) it is essentially a semi-solid, jelly-like substance
which demonstrates sufficient structural integrity such that
it does not creep or flow during fabrication of said package
assembly.2
THE EVIDENCE
2The underlying specification indicates that the
recitation of the “integral sealing member” further defines
the preceding recitation of the “sealing material.”
2
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