Appeal No. 1997-3120
Application No. 08/219,853
is adequately illustrated by independent claims 34 and 64 1
which read as follows:
34. A method for mounting a semiconductor chip on a
substrate comprising the steps of:
forming a conductive pattern on one side of a substrate
having an insulated surface;
forming a conductive projection at a predetermined
position on said conductive pattern;
mounting said semiconductor chip on said substrate
utilizing a UV curable adhesive having conductive particles
within the adhesive such that when said substrate and
projection are adhered to the semiconductor chip, a conductive
pad of said chip is electrically connected to said projection
by said particles within said adhesive; and
curing said organic adhesive by irradiating said adhesive
with UV light from another side of said substrate.
64. A method of producing electrode patterns comprising
the steps of:
forming a paste pattern of a resin paste loaded with
conductive metal particles;
baking said paste pattern; and
pressing the baked pattern to produce an even top
surface.
1We note that the term "organic" in the penultimate line
of claim 34 lacks antecedent basis. The consequent
informality should be corrected upon return of the application
to the jurisdiction of the examiner by deleting the term
"organic" from claim 34.
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