Appeal No. 1998-0296
Application 08/431,312
The invention relates to plastic packages for electronic
semiconductor devices (specification, page 1, lines 8-14). A
leadframe (figure 9, number 1) supports a semiconductor
element (figure 9, number 2) with an integrated circuit formed
thereon. A plastic package is formed around the leadframe and
semiconductor by injection molding of a resin (specification,
page 2, line 19 through page 3, line 10). The shape of the
plastic package includes top and bottom surfaces which are
both concave, and the plastic package has a maximum thickness
at the edges and a minimum thickness in the central region
(specification, page 15, lines 7-14). The difference between
the maximum and minimum thicknesses of the package is set to
compensate for expected deformation (specification, page 15,
line 10 through page 16, line 15).
Independent claim 21 is reproduced as follows:
21. A plastic package for an integrated electronic
semiconductor device, comprising:
a metal leadframe on which a semiconductor element is
placed, wherein an integrated electronic circuit has been
formed on said semiconductor element and is electrically
connected to said metal leadframe; and
a plastic body which encloses said semiconductor element
and said leadframe so as to leave outside, for electrical
connection, ends of a plurality of terminal leads formed on
2
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