Appeal No. 1998-2969
Application No. 08/317,818
BACKGROUND
The appellants’ invention relates to a resin-sealed laser diode device. The two
light-emitting end faces of the diode having two layers thereon, an end-face protecting
film and an end-face breakage preventing film of organic silicone resin. An
understanding of the invention can be derived from a reading of exemplary claim 1,
which is reproduced below.
1. A resin-sealed laser diode device, comprising:
a laser diode chip having front and rear light-emitting end faces through which a
laser beam from an active layer is emitted forwardly and backwardly;
end-face protecting films protecting said light-emitting end faces;
a lead frame supporting said chip through a supporting substrate;
a sealing resin sealingly isolating said chip from outside air; and
an end-face breakage preventing film of organic silicone resin low in an
absorption coefficient to a band of wavelengths of said laser beam, for preventing said
sealing resin near said light-emitting end faces from being damaged by said laser
beam,
wherein said organic silicone resin is like rubber and contains dimethyl
polysiloxane, and wherein said end-face protecting films contain silicon dioxide at least
at a surface in contact with said organic silicone resin.
The prior art references of record relied upon by the examiner in rejecting the
appealed claims are:
Amano et al. (Amano) 5,355,385 Oct. 11, 1994
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