Appeal No. 1999-0715
Application No. 08/486,173
providing at least one conductive metal strip
constructed to enable interconnection between
electrodes of components to be electrically
interconnected;
providing a metal-based material composed of a
silver-silicone paste mixed with a hardening agent;
and
securing the at least one conductive metal strip
to the electrodes using the metal-based material
intermediate the metal strip and the electrode.
In addition to the state of the art found in appellants’
specification, the examiner relies upon the following
reference as evidence of obviousness:
Arndt 2,423,922 Jul. 15, 1947
Appellants’ claimed invention is directed to a process of
electrically interconnecting electrodes of electronic
components. The process comprises utilizing a material
composed of a silver-silicone paste and a hardening agent to
secure a conductive metal strip to the electrodes. According
to appellants, “[e]lectrical interconnects made by this
invention have shown no degradation under high current testing
while having a very low contact resistance value and have
eliminated the solder-caused breakage problem for thin solar
cells” (page 2 of brief, penultimate paragraph).
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