Appeal No. 1999-0729
Application No. 08/625,752
positioning an electrically conductive pattern on a first
component surface;
applying a curable resin having adhesive properties to
said first component surface, wherein said resin is in
contacting relation with said conductive pattern;
positioning a second component surface in contacting
relation with said resin; and
sweeping said resin and said conductive pattern with
variable frequency microwaves selected from at least one
window of microwave frequencies, said at least one window
selected to avoid damage to said first and second components,
said sweeping performed at a rate selected to uniformly heat
said conductive pattern and cure said resin wherein said first
and second components are bonded together along said pattern.
In the rejection of the appealed claims, the examiner
relies upon the following references:
Gray et al. (Gray) 4,565,728 Jan. 21, 1986
Paulauskas et al. (Paulauskas) 5,603,795 Feb. 18, 1997
Bandaruk et al. (Bandaruk) 263883 Oct. 17, 1963
(Australian patent specification)
Appellants' claimed invention is directed to a method of
bonding components utilizing a curable resin which comprises
sweeping the resin with variable frequency microwaves at a
rate which uniformly heats the resin. According to page 13 of
the present specification, "[t]he rate at which the different
frequencies are launched is referred to as the sweeping rate"
(lines 36 and 37). The specification states at page 14 that
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