Appeal No. 1999-1088
Application 08/689,867
27. A semiconductor design comprising:
a plurality of first electric conductors;
a first insulating film overlying said plurality of first electric conductors;
a plurality of polysilicon thin film resistors overlying said first insulating film, each of
said resistors having two ends, and each of said resistors overlying a respective one of
said first electric conductors, with said resistors being disposed along a line with said
resistors being spaced from one another along the line and said two ends of each of said
resistors being spaced apart along the line;
first conducting means connected to said ends of said resistors for connecting said
resistors together in series; and
a plurality of first connecting means conductively connecting each of said first
electric conductors to one said end of the respective overlying one of said resistors so that
each of said first electric conductors is at the same potential as the respective one of said
resistors.
The following references are relied upon by the examiner:
MacElwee 5,296,726 Mar. 22, 1994
Furuya et al. (Furuya) 5,428,242 June 27, 1995
Tasaka 5,490,106 Feb. 6, 1996
Mead et al. (Mead), Introduction To VLSI Systems, Addison-Wesley Publishing Company,
pp. 5-6 (1980).
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