Appeal No. 1999-1127
Application 08/689,164
atop the substrate and one another by thermal spraying of
respective insulating or conducting material through
correspondingly defined apertures in spray masks. Inter-layer
electrical connections are intrinsically formed by direct
metallurgical bonding between the conducting material of an
overlaying layer and the conducting material of a previously
sprayed layer. The defined apertures are formed through the
use of positive and negative systems.1
Independent claim 1 is reproduced as follows:
1. An interconnect device for interconnecting electronic
components comprising:
a substrate;
a first conducting layer including conductive traces
deposited over said substrate in a first pattern by thermal
spraying;
a first insulating layer deposited over said first
conducting layer by thermal spraying in a second pattern not
including selected regions of said first conducting layer,
said first insulating layer adhering to said first conducting
layer by mechanical bonding as a result of thermal spraying;
and
a second conducting layer deposited over said first
insulating layer and said first conducting layer by thermal
spraying in a third pattern including at least one of said
selected regions, said second conducting layer adhering to
1See pages 2-3 of the brief.
2
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