Appeal No. 1999-1463
Application 08/467,052
a Peltier effect element mounted on an inner surface of said metal casing by
soldering;
said metal casing having a Peltier effect element mounting region in the inner
surface of said metal casing on which said Peltier effect element is mounted, the area of
said Peltier effect element mounting region being substantially equal to that of the bottom
surface of said Peltier effect element;
wherein an entire periphery of said Peltier effect element mounting region is raised
with respect to a region of said metal casing adjacent to said Peltier effect element
mounting region such that extra solder squeezed out from under the Peltier effect device
during the soldering will flow away from the Peltier effect device instead of up onto the
device.
The following references are relied on by the examiner:
Kluitmans et al. (Kluitmans) 5,005,178 Apr. 2, 1991
Greve et al. (Greve) 5,031,184 July 9, 1991
Herbst, II (Herbst) 5,457,342 Oct. 10, 1995
(filing date Mar. 30, 1994)
Claims 1-4 stand rejected under 35 U.S.C. § 103. Although the answer indicates
that claims 1, 2 and 4 stand rejected under 35 U.S.C. § 103 as being obvious over the
combination of Kluitmans in view of Herbst, the final rejection from which this appeal was
taken clearly indicates that the examiner has rejected claims 1, 3 and 4 on the basis of this
combination of references. We agree with the assessment of this as set forth in the brief
and reply brief. Correspondingly, the answer indicates that claim 3 is rejected in light of
the combination of teachings of Kluitmans in view of Greve. The final rejection indicates
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