Appeal No. 1999-2143
Application No. 08/734,866
The subject matter on appeal relates to a method for
implementing a process for monitoring a solder paste printing process
in the setting and soldering of a circuit board. (Substitute appeal
brief, page 3.) Further details of this appealed subject matter are
recited in illustrative claim 1, which is reproduced below from the
amendment filed August 28, 1997 as further amended on February 23,
1998:2
1. A method for implementing a process for
monitoring the solder paste printing process in the
setting and soldering of a circuit board, in which paste
printing process solder paste (5) is spread on a circuit
board (4) at the solder pads (7) of surface mounted
devices or corresponding connecting pins, characterized in
that for evaluating the quality of the paste printing
process at least one paste test pattern (9; 10; 18) is
arranged on the circuit board (4; 13), which test pattern
is constituted by a number of test elements (91, 92, 93,
94; 111, 112, 113, 114; 121, 122, 123, 124), the shapes of
which correspond to geometrical plane figures on the
surface of the circuit board, which test elements have
varying degrees of difficulty in view of the printing
process, and wherein the spatial relationship between test
elements is such that the distance between one test
element and another is different and each of said test
elements has different width and the distance between
2 Although the examiner states in the answer (page 2) that the
copy of the appealed claims as found in the appendix to the
appellants’ substitute brief is correct, we observe that this is not
the case. Specifically, claim 1 as reproduced in the appendix to the
substitute brief does not incorporate the change made in the
amendment under 37 CFR § 1.116 filed February 23, 1998, which the
examiner entered.
2
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