Appeal No. 1999-2277
Application 08/803,578
inventor decided to use an adhesive in addition to bond joints.
Others might opt for the less costly manufacturing process and
decide to eliminate the adhesive.” Examiner’s Answer at page 4.
Our analysis of Kudo reveals the use of an adhesive
between the slider and a flexible wiring substrate:
The magnetic head slider[] is bonded by means of an
adhesive (not shown) on the upper surface of the flexible
wiring substrate[] which is formed on the gimbal[] of the
suspension[]. Column 5, lines 53-56.
However, we find that the use of an adhesive to accomplish a
bond between the slider and the flexible wiring substrate is
integral to the Kudo invention rather than an optional
embodiment of Kudo. This adhesive requirement is further
evidenced by Kudo’s claim 1 which recites in part:
A device for supporting a magnetic head slider having . .
. a support member for supporting the magnetic head slider,
said bottom surface of said slider being fixed to said
support member by an adhesive; . . . . (Emphasis added).
Column 7, line 62 to column 8, line 3.
We further find no evidence or suggestion that Kudo would
accomplish the bonding between the slider and the flexible
wiring substrate by means other than an adhesive. Kudo uses
gold ball bonding to connect the signal terminals to the signal
electrodes. Kudo discloses:
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