Appeal No. 1999-2684
Application No. 08/825,400
BACKGROUND
Appellants’ invention relates to a circuit board having solder bumps. An
understanding of the invention can be derived from a reading of exemplary claim 1,
which is reproduced below.
1. A circuit board comprising:
a substrate having a joining surface; and
a plurality of solder bumps disposed on said joining surface of said
substrate in such a manner as to form a predetermined profiled line or
surface pattern;
wherein said solder bumps have tops which are free, flat and
leveled.
The prior art reference of record relied upon by the examiner in rejecting the
appealed claims is:
Degani 5,564,617 Oct. 15, 1996
(filed June 7, 1995)
Claims 1 and 12 stand rejected under 35 U.S.C. § 102 as being unpatentable over
Degani. Claims 2-4 stand rejected under 35 U.S.C. § 103(a) as being unpatentable
over Degani.
Rather than reiterate the conflicting viewpoints advanced by the examiner and
appellants regarding the above-noted rejections, we make reference to the examiner's
answer (Paper No. 20, mailed May 12, 1999) for the examiner's reasoning in support of
2
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