Ex Parte BLALOCK et al - Page 1



               The opinion in support of the decision being entered                   
               today was not written for publication in a law journal                 
               and is not binding precedent of the Board.                             
                                                               Paper No. 37           

                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                                                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                                                                     
                               Ex parte GUY T. BLALOCK                                
                                         and                                          
                                  KEVIN G. DONOHOE                                    
                                                                                     
                                Appeal No. 2000-0042                                  
                             Application No. 08/948,179                               
                                                                                     
                                      ON BRIEF                                        
                                                                                     
          Before KIMLIN, LIEBERMAN and JEFFREY T. SMITH, Administrative               
          Patent Judges.                                                              
          KIMLIN, Administrative Patent Judge.                                        

                                 DECISION ON APPEAL                                   
               This is an appeal from the final rejection of claims 1-13,             
          15-27, 29 and 31, all the claims remaining in the present                   
          application.  Claim 1 is illustrative:                                      
               1.  A method of facet etching for use during the fabrication           
          of a semiconductor device, said method comprising:                          

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