Appeal No. 2000-0421
Application 08/912,429
amendment after final rejection was filed on December 2, 1998 and
was entered by the examiner.
The disclosed invention pertains to a method of packaging a
flip chip and to the flip chip package which results therefrom.
Representative claim 1 is reproduced as follows:
1. A method of packaging a flip chip, comprising the
following steps:
coupling an integrated circuit (IC) chip to a first side of
a package substrate;
placing at least one first electrical interconnection on a
second side of said package substrate which is coupled to said IC
chip; and,
positioning at least one second electrical interconnection
on said second side of said package substrate and underlying a
shadow region of said IC chip, wherein said at least one second
electrical interconnection reduces the shear and bending stress
on said at least one first electrical interconnection.
The examiner relies on the following references:
Pastore et al. (Pastore) 5,285,352 Feb. 08, 1994
Ho 5,598,036 Jan. 28, 1997
Bond et al. (Bond) 5,642,261 June 24, 1997
Claims 1, 2, 5, 6, 9, 10, 13 and 14 stand rejected under 35
U.S.C. § 102(b) as being anticipated by the disclosure of
Pastore. Claims 1, 2, 5, 6, 9, 10, 13 and 14 also stand rejected
under 35 U.S.C. § 102(e) as being anticipated by the disclosure
of Bond. Claims 1-3, 5-7, 9-11 and 13-15 stand rejected under 35
U.S.C. § 103. As evidence of obviousness the examiner offers Ho
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