Appeal No. 2000-1082 2
Application No. 08/727,303
THE INVENTION
The invention is directed to a method of processing a workpiece having a
multiplicity of recesses. A first layer of material is deposited on the workpiece so as to
completely close the recesses and leave voids beneath the first layer. Thereafter sufficient
temperature and pressure is applied so as to cause the first layer to deform without melting
and fill the voids. Furthermore, a second layer is deposited atop the first layer.
Additional limitations are disclosed in the following illustrative claim.
THE CLAIM
Claim 1 is illustrative of appellants’ invention and is reproduced below.
1. A method of processing a workpiece having a multiplicity of recess formed in an
exposed surface, the multiplicity of recess having respective openings, said method
comprising:
depositing a first layer of material on the exposed surface until the first layer extends
over all the recesses to close completely the openings of all the recesses in the exposed
surface and to form respective voids within the recesses beneath the first layer;
increasing a pressure and a temperature applied to the wafer and the first layer after
the respective voids have been formed with the recesses beneath the first layer, to cause
parts of the first layer to deform, without melting, to fill the voids in the respective
recesses; and
depositing a second layer of material on top of the first layer after said depositing of
the first layer and either prior to or during application of the increased temperature and
pressure.
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