Appeal No. 2000-1103
Application No. 08/576,367
(f) separating the conductive layer and solidified flowable material in the
cavity from the mold to provide a microstructure having a shape
complementary to the mold;
(g) electrodepositing a metal layer on the complementary microstructure; and
(h) separating the metal layer from the complementary structure to provide a
metallic microstructured element.
CITED PRIOR ART
As evidence of unpatentability, the Examiner relies on the following references:
Reichert 3,993,515 Nov. 23, 1976
Geissler et al. (Geissler) 4,759,887 Jul. 26, 1988
Hashiguchi et al. (Hashiguchi) 5,358,909 Oct. 25, 1994
Wuensch et al. (Wuensch) 5,415,977 May 16, 1995
Milinkovic et al. (Milinkovic) 5,470,651 Nov. 28, 1995
Koseki et al. (Koseki) 5,702,810 Dec. 30, 1997
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