Appeal No. 2000-1664
Application No. 09/114,790
respective positions articulated by the appellants and the
examiner. As a consequence of our review, we make the
determinations which follow.
McAllister discloses a method of forming a multilayer thin
film structure which comprises a series of layers. The layers
include a dialectric layer which has metal thereon and a top
surface layer which has vias, chip connection pads, and via-pad
connection staps thereon. McAllister does not disclose that the
surface layer includes a plurality of orthogonal X conductor
lines and Y conductor lines.
Appellants argue that McAllister is silent with regard to
the need for a plurality of orthogonal X conductor lines and Y
conductor lines on the top surface of the MLTF.
The examiner concludes that although McAllister does not
expressly disclose the formation of orthogonal X and Y conductor
lines, it is within the ordinary skill of the person of ordinary
skill in the art given the teaching of McAllister that X and Y
conductor lines could be formed (final rejection at page 3).
The examiner also states, in the answer at page 3, that it is
3
Page: Previous 1 2 3 4 5 6 7 Next
Last modified: November 3, 2007