Ex parte TSAI et al. - Page 1




               The opinion in support of the decision being entered                   
               today was not written for publication in a law                         
               journal and is not binding precedent of the Board.                     
                                                               Paper No. 15           


                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                                                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                                                                     
                      Ex parte CHIA-SHIUN TSAI, CHAO-CHENG CHEN                       
                                   and HUN-JAN TOO                                    
                                                                                     
                                Appeal No. 2000-1810                                  
                             Application No. 09/148,556                               
                                                                                     
                                      ON BRIEF                                        
                                                                                     

          Before KIMLIN, OWENS and TIMM, Administrative Patent Judges.                
          KIMLIN, Administrative Patent Judge.                                        



                                 DECISION ON APPEAL                                   
               This is an appeal from the final rejection of claims 1-                
          15, all the claims in the present application.  Claim 1 is                  
          illustrative:                                                               
          1.   A method for forming a patterned oxygen containing plasma              
          etchable layer comprising:                                                  

                                         -1-                                          





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