Ex Parte BOLL et al - Page 1




            The opinion in support of the decision being entered today was not written
                   for publication and is not binding precedent of the Board.         

                                                                 Paper No. 27         

                       UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                     ____________                                     
                          BEFORE THE BOARD OF PATENT APPEALS                          
                                  AND INTERFERENCES                                   
                                     ____________                                     
                      Ex parte HARRY J. BOLL and GREGORY G. BOLL                      
                                     ____________                                     
                                 Appeal No. 2000-2053                                 
                              Application No. 08/764,353                              
                                     ____________                                     
                                       ON BRIEF                                       
                                     ____________                                     
          Before KRASS, LALL, and GROSS, Administrative Patent Judges.                
          LALL, Administrative Patent Judge.                                          


                                  DECISION ON APPEAL                                  
               This is a decision on appeal under 35 U.S.C. § 134 from                
          the Examiner's final rejection of claims 1-4, and 17, all the               
          pending claims in the application.                                          
               According to Appellants (brief at pages 1 and 2), the                  
          disclosed invention pertains to a probe card for high speed                 
          testing.  This testing involves the testing of integrated                   
          circuits (IC’s), also called chips or wafers.  If the testing               
          shows that the design or the process employed to manufacture the            








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