Appeal No. 2000-2251 Page 2
Application No. 08/902,206
In contrast, the appellant selects the functionality of an IC by bonding out (i.e.,
grounding) or not bonding out particular bonding pads. The bonding pads are
connected to a decoder located on the IC. Based on which bonding pads have been
bonded out, the decoder determines which path of a predetermined number of paths is
to be chosen to provide the selected function. More specifically, four bonding pads are
provided, and sixteen combinations are possible from the four pads. The decoder
determines which of the sixteen options has been selected and feeds the selection to a
circuit that generates control signals responsive thereto. The control signals are fed to
logic circuits that control functions of sub-circuits within the various portions of the IC.
By determining the function of the sub-circuits, the overall functionality of the IC is
dictated. (Id. at 3.)
A further understanding of the invention can be achieved by reading the following
claim:
14. An apparatus for controlling functionality in an integrated circuit
by bond optioning including:
bond option means for providing a plurality of signals; and
decoder means for receiving said signals and providing a number
of outputs each having a state depending on which of said bond option
means is bonded out.
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