Appeal No. 2001-0018
Application 08/998,559
The disclosed invention pertains to a combined acoustic
backing and interconnect module for connecting an array of
ultrasonic transducer elements to a multiplicity of cable
conductors which utilizes the volume of the backing layer to
extend a high density of interconnections perpendicular to the
transducer array.
Representative claim 6 is reproduced as follows:
6. A combined acoustic backing and interconnect module
comprising:
a first flexible planar circuit board having a first
multiplicity of conductive traces, and support means attached to
opposing sides of a section of said first flexible circuit board
and having a planar surface extending generally perpendicular to
said section of said first flexible planar circuit board, an end
of each of said first multiplicity of conductive traces being
exposed at said planar surface of said support means, said
support means being made of acoustic damping material.
The examiner relies on the following reference:
Kawabe et al. (Kawabe) 4,825,115 Apr. 25, 1989
Claims 6-12 stand rejected under 35 U.S.C. § 103. As
evidence of obviousness the examiner offers Kawabe taken alone.
Rather than repeat the arguments of appellants or the
examiner, we make reference to the briefs and the answer for the
respective details thereof.
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