Appeal No. 2001-0106
Application 08/855,811
Claim 1 of the instant application recites a device comprising a metal substrate,
an electrically conductive adhesive bonded to the metal substrate, and a layer of
coupling agent (organosilane, organonitrate, or organozirconate) between the substrate
and adhesive. The coupling agent is bonded to the metal and to the electrically
conductive adhesive.
Claim 3 requires the layer to be 100 Angstroms or less.
Claim 6 recites an electrical component comprising a metal substrate, a layer of
a coupling agent (organosilane, organonitrate, or organozirconate) on the substrate, an
adhesive (not necessarily conductive) bonded to the layer of coupling agent, and an
electrically conductive adherend. The coupling agent is bonded to the metal of the
substrate and is also reacted with the adhesive.
Claim 7 requires an additional layer of coupling agent between the adhesive and
the adherend.
Claim 10 recites a process for improving electrical properties of a bond,
comprising applying a coupling agent (organosilane, organonitrate, or organozirconate)
to a metal substrate, and applying a conductive adhesive. The coupling agent material
must be capable of bonding with the metal and reacting with the adhesive.
Tollefson discloses at least:
(1) a metal electrically conductive stripe (column 3, lines 14 et seq.)
(2) a conductive adhesive material applied to the metal stripe (column 4, lines 31-
36)
(3) the adhesive contains an interacted functionally reactive organosilane
coupling agent (column 4, lines 47-49)
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