Appeal No. 2002-0579 Page 6
Application No. 09/324,780
unpatentable over Oppermann in view of Williams, we have no choice but to summarily
sustain the examiner’s rejections of these claims.
Claims 7-12 and 21-23
Oppermann (see Figures 17-20) discloses a chip module comprising a chip
carrier 76, conductor path structure 83 including a plurality of conductor paths 82 each
having a chip bonding region 89, rod conductor 87 and circular flat conductor 88, an
orifice 90 in the chip carrier 76 exposing the chip bonding region, a recess 91 in the
chip carrier 76 exposing the circular flat conductor 88 and a chip 75 bonded to the
conductor path structure at chip bonding regions 89 of the conductor paths 82. As
disclosed in column 12, lines 26-34,
[a] particular advantage of the connecting construction
shown in FIGS. 17 to 20 is that both the recess 91 and the
orifice 90 in the chip carrier 76 can be filled with connecting
material 95 in one and the same process step so, on the one
hand, external bonding bumps 96 are created for the
external attachment face arrangement 80 of the chip carrier
76 and, on the other hand, internal connections 97 between
the wafer 73 or the chips 75 formed coherently thereby and
the chip carriers 76 are created.
We, like appellant, understand the “connecting material 95" disclosed by Oppermann to
be a conductive material. However, we do not agree with appellant (brief, page 17) that
the presence of conductive filling material, rather than non-conductive filling material, in
Oppermann’s orifices and recesses constitutes a distinction between the subject matter
of claims 7-12 and 21-23 and Oppermann’s chip module. Simply stated, claims 7-12
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