Appeal No. 1999-0544 Page 2
Application No. 08/324,842
BACKGROUND
Appellants’ invention relates to a process for the selective deposition of metal on
substrates (specification at 1, ll. 4-5). Claim 1 is illustrative:
1. A method for forming a metallic coating on a surface of a substrate, comprising the
steps of:
applying a layer of energy definable resist material on a ceramic substrate;
patterning the resist layer such that a first portion of the substrate surface is covered by
the resist layer and a second portion of the substrate surface is not covered by the resist layer;
treating the second portion of the surface with a reagent to promote the electroless plating
of metal onto the substrate;
drying the surface of the substrate after treating the surface;
removing the resist layer;
exposing the surface to an electroless metal plating bath such that metal is formed on the
surface; and
heating the surface of the substrate to about 180/C to about 350/C for a time sufficient
for the metal to adhere to the substrate.
The prior art references of record relied upon by the Examiner in rejecting the appealed
claims are:
Honjo et al. (Honjo) 4,510,179 Apr. 9, 1985
Akoh 4,748,086 May 31, 1988
Reyes et al. (Reyes) 4,685,030 Aug. 4, 1987
Dickirson et al. (Dickirson) 5,219,292 June 15, 1993
Portner 5,288,313 Feb. 22, 1994
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