Appeal No. 1999-0591
Application 08/581,905
The disclosed invention pertains to a method for securing
a semiconductor die within a cavity of a fixture for performing
operations on the semiconductor die. More particularly, the
invention uses a piece of tape having an adhesive coating thereon
which has been cut and transferred to the cavity within the
fixture, and which adhesively holds the die in the cavity.
Representative claim 1 is reproduced as follows:
1. A method of retaining a semiconductor die in a
fixture to perform operations on said die, said method
comprising:
providing said fixture;
providing tape having adhesive on at least one side
thereof;
cutting a piece of the tape having a size to fit in said
fixture;
transferring the piece of the tape to said fixture;
placing said semiconductor die on the piece of the tape
transferred to said fixture;
adhesively securing one of said fixture and said
semiconductor die by the adhesive on at least one side of the
piece of tape;
performing operations on said semiconductor die when
mounted in said fixture;
removing said die from said fixture after performing said
operations on said die; and
2
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