Appeal No. 1999-1143
Application No. 08/735,925
The subject matter on appeal relates to a method for
bonding a silicon-containing polymeric adhesive to a nickel
metal surface having poor direct adherability to the adhesive
which comprises depositing on the nickel metal surface a thin
adherent metal film of chromium, molybdenum, tungsten and
alloys thereof, contacting an uncured silicone elastomeric
material to the thin adherent metal film and solidifying the
silicone elastomeric material, wherein the thin adherent metal
film has a thickness effective to bond the surface to the
adhesive (e.g., see claim 22). The appealed subject matter
also relates to the product resulting from this process (e.g.,
see claim 32). This appealed subject matter is adequately
illustrated by independent claim 22 which reads as follows:
22. A method for bonding a silicon-containing polymeric
adhesive to a metal having poor direct adherability to such
polymeric adhesive, comprising the steps of:
(a) providing an uncured silicone elastomeric material
and a substrate comprising a substrate surface containing
nickel;
(b) depositing a thin adherent metal film on said
substrate surface, wherein said thin adherent metal film is a
metal selected from the group consisting of chromium, Mo, and
W, and alloys thereof;
(c) contacting said silicone elastomeric material to said
thin adherent metal film; and
2
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