Ex Parte FIELD - Page 2




                Appeal No. 1999-1871                                                                                  Page 2                   
                Application No. 08/688,337                                                                                                     

                                                             BACKGROUND                                                                        
                         Appellant’s invention relates to micromachining, and more particularly, to a method for                               
                constructing suspending structures such as diaphragms and membranes (specification at 1, ll. 5-                                
                6).  Claims 1 and 8 are illustrative:                                                                                          
                         1. A method for fabricating a suspended structure comprising a layer of membrane                                      
                material over a substrate, said suspended structure overlying a cavity in said substrate, said                                 
                method comprising steps of:                                                                                                    
                         generating a sacrificial layer comprising a first material that will remain bonded to said                            
                substrate at a temperature greater than 450BC.                                                                                 
                         depositing said layer of membrane material over said sacrificial layer, said membrane                                 
                material comprising a second material different from said first material;                                                      
                         opening at least one via in said layer of membrane material thereby exposing said                                     
                sacrificial layer;                                                                                                             
                         applying a first etchant to said sacrificial layer through said via until said sacrificial layer                      
                is removed leaving a portion of said cavity, said first etchant being chosen such that said first                              
                etchant removes said first material more rapidly than said second material; and                                                
                         introducing a second etchant into said cavity, said second etchant being chosen such that                             
                said second etchant removes said substrate more rapidly than said second material.                                             
                         8. The method of claim 1, wherein:                                                                                    
                         said step of generating a sacrificial layer includes a step of depositing a layer of said first                       
                material on said substrate;                                                                                                    
                         said step of opening at least one via in said layer of membrane material defines a location                           
                of said cavity in said substrate; and                                                                                          
                         said step of applying said first etchant to said sacrificial layer through said at least one via                      
                is performed for a predetermined time to remove a portion of said first material overlying said                                
                location of said cavity in said substrate.                                                                                     








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