Appeal No. 2001-0684
Application No. 09/205,668
BACKGROUND
Appellants’ invention relates to an integrated electronic device comprising a
mechanical stress protection structure. An understanding of the invention can be
derived from a reading of exemplary claim 1, which is reproduced below.
1. An integrated electronic device comprising:
a semiconductor material body;
an electronic component housed in said semiconductor material
body and having a periphery;
an electrically insulating region extending on top of said
semiconductor material body and including a central portion positioned
directly above all of the electronic component;
a pad region extending on top of said electrically insulating region;
and
a protection structure of a material different from and extending into
said electrically insulating region, said protection structure contacting and
extending downward from portions of the pad region that are not directly
above said electronic component, said protection structure including a
peripheral portion extending around a predominant part of the central
portion of the electrically insulating region.
The prior art references of record relied upon by the examiner in rejecting the
appealed claims are:
Chittipeddi et al. (Chittipeddi) 5,751,065 May 12, 1998
(Filed Oct. 30, 1995)
Wollesen 5,900,668 May 4, 1999
(Filed Nov. 30, 1995)
2
Page: Previous 1 2 3 4 5 6 7 8 Next
Last modified: November 3, 2007