The opinion in support of the decision being entered today was not written for publication and is not binding precedent of the Board. Paper No. 19 UNITED STATES PATENT AND TRADEMARK OFFICE ____________ BEFORE THE BOARD OF PATENT APPEALS AND INTERFERENCES ____________ Ex parte LEWIS S. GOLDMANN and CHANDRIKA PRASAD ____________ Appeal No. 2001-1618 Application No. 08/960,565 ____________ ON BRIEF ____________ Before HAIRSTON, FLEMING, and GROSS, Administrative Patent Judges. GROSS, Administrative Patent Judge. DECISION ON APPEAL This is a decision on appeal from the examiner's final rejection of claims 1 through 22, which are all of the claims pending in this application. Appellants' invention relates to a spring contact for temporary attachment of a semiconductor wafer to a test and/or burn-in apparatus, where the spring is formed of a shape memory metal. Claim 1 is illustrative of the claimed invention, and it reads as follows: 1. A spring contact for temporary attachment of a semiconductor wafer to a test and/or burn-in apparatus, said spring fabricated from one of a shape memory metal, said shapePage: 1 2 3 4 5 6 NextLast modified: November 3, 2007