Ex Parte GOLDMANN et al - Page 1




               The opinion in support of the decision being entered today was not     
               written for publication and is not binding precedent of the Board.     
          Paper No. 19                                                                
                       UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                     ____________                                     
                          BEFORE THE BOARD OF PATENT APPEALS                          
                                   AND INTERFERENCES                                  
                                     ____________                                     
                    Ex parte LEWIS S. GOLDMANN and CHANDRIKA PRASAD                   
                                     ____________                                     
                                 Appeal No. 2001-1618                                 
                              Application No. 08/960,565                              
                                     ____________                                     
                                       ON BRIEF                                       
                                     ____________                                     
          Before HAIRSTON, FLEMING, and GROSS, Administrative Patent Judges.          
          GROSS, Administrative Patent Judge.                                         



                                  DECISION ON APPEAL                                  
               This is a decision on appeal from the examiner's final                 
          rejection of claims 1 through 22, which are all of the claims               
          pending in this application.                                                
               Appellants' invention relates to a spring contact for                  
          temporary attachment of a semiconductor wafer to a test and/or              
          burn-in apparatus, where the spring is formed of a shape memory             
          metal.  Claim 1 is illustrative of the claimed invention, and it            
          reads as follows:                                                           
               1.   A spring contact for temporary attachment of a                    
          semiconductor wafer to a test and/or burn-in apparatus, said                
          spring fabricated from one of a shape memory metal, said shape              





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