Ex Parte ELLIOT et al - Page 5




          Appeal No. 2001-2203                                                        
          Application No. 09/007,949                                                  


          Appellants assert that the Examiner has failed to establish a prima         
          facie case of obviousness since all of the claimed limitations are          
          not taught or suggested by the applied prior art references.  In            
          particular, Appellants contend (Brief, pages 3-6), that neither Lee         
          nor Wilson has any teaching or suggestion of the diffusion of a             
          selected alloying element from a first metal into the other of the          
          first and second metal layers resulting in a “. . . substantially           
          continuous concentration diffusion gradient of said selected                
          alloying element between said first metal layer and said second             
          metal layer” as claimed.                                                    
               After careful review of the Lee and Wilson references, in              
          light of the arguments of record, we are in general agreement with          
          Appellants’ position as stated in the Brief.  In particular, we             
          find no disclosure in Lee, relied on by the Examiner as teaching            
          the claimed diffusion gradient, of the diffusion between first and          
          second metal layers as claimed that would satisfy the requirements          
          of appealed claim 1.  We note that, while the Examiner has cited            
          (Answer, pages 4 and 5) several portions of the disclosure of Lee           
          in support of the stated rejection, each of the cited portions are          
          directed to different embodiments of the semiconductor device of            
          Lee.  For example, the disclosure at column 17, lines 30-66 in Lee          
          is directed to the Figure 20 embodiment in which heat treatment             
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