Appeal No. 2001-2209
Application No. 09/019,158
Further provided are a bonding wire for electrically connecting the light-emitting chip and the distal
end of the other of the leads and a light-transmitting resin envelope for sealing the light-emitting
chip, the bonding wire, and the distal ends of the leads. More particularly, the resin envelope is
elliptical in shape as opposed to the circular shape of the conventional resin envelope. According to
Appellants (Specification, page 8), the elliptical cross-sectional configuration of the resin envelope
results in enhanced light output without sacrificing production efficiency.
Claim 14 is illustrative of the invention and reads as follows:
14. A semiconductor light-emitting device comprising:
at least two parallel leads having adjacent distal ends;
a semiconductor light-emitting chip mounted on the distal end of one of said leads;
a bonding wire for electrically connecting the semiconductor light-emitting chip and the
distal end of another of the at least two leads; and
a light transmitting resin, for sealing said semiconductor light-emitting chip, said bonding
wire, and the distal ends of said leads, the light-transmitting resin having a side surface defined in
lateral cross section by an ellipse having a long axis and a short axis, the long axis being
perpendicular to a lateral straight line as extending through said at least two parallel leads, and a
convex external end surface for transmitting light from the semiconductor light-emitting chip to the
exterior of the light-transmitting resin.
The Examiner relies on the following prior art references:1
1 In addition, the Examiner relies on Appellants’ admitted prior art illustrated in Figures 1 through 4B and
(continued...)
2
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