Appeal No. 2001-2255
Application 09/027,856
The disclosed invention pertains to a structure which
results from a method for electrolessly plating of metal,
particularly gold and copper, on substrates such as circuitized
substrates. A particular feature of the invention is the
composition of the cured, photoimaged, permanent plating resist.
Representative claim 12 is reproduced as follows:
12. A circuitized structure comprising:
a. a circuitized substrate;
b. a first layer of metal features disposed on the
substrate;
c. a cured, photoimaged, permanent plating resist having
photoimaged apertures disposed therein, said permanent plating
resist disposed on the substrate,
wherein the permanent plating resist comprises an epoxy
resin system comprising:
i. from about 10 to 80% of phenoxy polyol resin which is
the condensation product of epichlorohydrin and bisphenol A,
having a molecular weight of from about 40,000 to 130,000;
ii. from about 20 to 90% of an epoxidized multifunctional
bisphenol A formaldehyde novolac resin having a molecular
weight of from about 4,000 to 10,000;
iii. from 0 to 50% of a diglycidyl ether of bisphenol A
having a molecular weight of from 600 to 2,500; and
iv. less than 15% of a cationic photoinitiator; and less
than about 8% solvent;
f. electrolessly plated gold, disposed on portions of the
metal features, and said gold disposed in the apertures;
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