Appeal No. 2002-0130
Application No. 09/265,479
through 9 of their Brief, the examiner refers to electrically
conductive adhesive 222 in Figure 4. See column 9, lines 7-27.
There is nothing in Krishnamurthy that such adhesive is used as
“dielectrical” adhesive layer 22 of Figures 1a and 1b. See
Krishnamurthy in its entirety. Nor would a person having
ordinary skill in the art readily envisage employing electrically
conductive adhesive 222 in Figure 4 as “dielectrical (non-
electrically conductive) adhesive layer 22 of Figures 1a and 1b.
Moreover, as is apparent from Figure 4, the electrically
conductive adhesive is employed in a different environment than
that illustrated in Figures 1a and 1b referred to by the
examiner. We find that electrically conductive adhesive 222 is
placed between compositionally identical conductive layer 2313
and ground plane 226 (e.g., a sheet or a thick layer of sputtered
copper). See column 9, lines 2-31. We observe nothing in
Krishnamurthy that describes bonding directly a ferrite disk and
a metal layer via an electrically conductive adhesive within the
meaning of 35 U.S.C. § 102.
3 Conductive layer 231 is said to be directly attached to ferrite
disk 232.
4
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