Appeal No. 2002-1048 Application No. 09/172,734 or a urethane bonding agent curable at room temperature” (column 1, lines 41-43; emphasis added). We are convinced that the aforequoted teachings of Denda would have led an artisan to believe that the 250o C reflow temperature of Etchells’ solder, while appropriate for certain electronic components such as semiconductor devices, would be entirely too high for a color image sensor since the latter is not heat-resistant and is generally bonded using agents curable at room temperature. Obviousness under Section 103 requires a suggestion for the modification in question as well as a reasonable expectation that the modification would be successful. See In re O’Farrell, 853 F.2d 894, 903-04, 7 USPQ2d 1673, 1680-81 (Fed. Cir. 1988). For the reasons discussed above, Etchells and Denda would not have suggested the modification proposed by the examiner and would not have provided an artisan with a reasonable expectation that the modification would be successful. On the contrary, the teachings of Denda would have led an artisan to expect that the examiner’s proposed modification would be unsuccessful. Under these circumstances, we cannot sustain the examiner’s Section 103 rejection of claims 1, 3-6 and 8-13 as being unpatentable over Etchells in view of Denda. Because the 5Page: Previous 1 2 3 4 5 6 7 NextLast modified: November 3, 2007