Ex Parte SENGUPTA et al - Page 5




          Appeal No. 2002-1048                                                        
          Application No. 09/172,734                                                  


          or a urethane bonding agent curable at room temperature” (column            
          1, lines 41-43; emphasis added).  We are convinced that the                 
          aforequoted teachings of Denda would have led an artisan to                 
          believe that the 250o C reflow temperature of Etchells’ solder,             
          while appropriate for certain electronic components such as                 
          semiconductor devices, would be entirely too high for a color               
          image sensor since the latter is not heat-resistant and is                  
          generally bonded using agents curable at room temperature.                  
               Obviousness under Section 103 requires a suggestion for the            
          modification in question as well as a reasonable expectation that           
          the modification would be successful.  See In re O’Farrell, 853             
          F.2d 894, 903-04, 7 USPQ2d 1673, 1680-81 (Fed. Cir. 1988).  For             
          the reasons discussed above, Etchells and Denda would not have              
          suggested the modification proposed by the examiner and would not           
          have provided an artisan with a reasonable expectation that the             
          modification would be successful.  On the contrary, the teachings           
          of Denda would have led an artisan to expect that the examiner’s            
          proposed modification would be unsuccessful.                                
               Under these circumstances, we cannot sustain the examiner’s            
          Section 103 rejection of claims 1, 3-6 and 8-13 as being                    
          unpatentable over Etchells in view of Denda.  Because the                   


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