Ex Parte Thompson et al - Page 1



          The opinion in support of the decision being entered today was              
          not written for publication and is not binding precedent of the             
          Board.                                                                      
                                                          Paper No. 12                
                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                     __________                                       
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                     __________                                       
                            Ex parte RAYMON F. THOMPSON,                              
                         ROBERT W. BERNER, GARY L. CURTIS,                            
                      STEPHEN P. CULLITON and BLAINE G. WRIGHT                        
                                     __________                                       
                                Appeal No. 2002-1823                                  
                               Application 09/575,551                                 
                                     ___________                                      
                                      ON BRIEF                                        
                                     ___________                                      
          Before FRANKFORT, STAAB, and MCQUADE, Administrative Patent                 
          Judges.                                                                     
          MCQUADE, Administrative Patent Judge.                                       
                                 DECISION ON APPEAL                                   
               Raymon F. Thompson et al. appeal from the final rejection of           
          claims 56, 57, 62, 64 and 65, all of the claims pending in the              
          application.                                                                
                                   THE INVENTION                                      
               The invention relates to “automated semiconductor wafer                
          processing systems for performing liquid and gaseous processing             
          of . . . semiconductor wafers, data disks, semiconductor                    


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