The opinion in support of the decision being entered
today was not written for publication in a law journal
and is not binding precedent of the Board.
Paper No. 12
UNITED STATES PATENT AND TRADEMARK OFFICE
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
Ex parte GREGORY D. SABIN, WILLIAM J. GROSS
and JUNG-YUEH CHANG
Appeal No. 2003-0241
Application No. 09/271,615
ON BRIEF
Before KIMLIN, WALTZ and MOORE, Administrative Patent Judges.
KIMLIN, Administrative Patent Judge.
DECISION ON APPEAL
This is an appeal from the final rejection of claims 1-31.
Claim 1 is illustrative:
1. A method for forming a bonding pad structure over an
active circuit of an integrated circuit device, the method
comprising the steps of:
depositing a metal layer over said active circuit;
patterning and etching said metal layer to form an
array of openings in said metal layer;
-1-
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