Appeal No. 2003-0249
Application 08/863,848
semiconductor die 114 by wires 118. The wires 118 extend from
semiconductor die 114 through a hole 120 of the printed circuit
board. The hole through the printed circuit board 122 may be
positioned at the central longitudinal axis of the printed
circuit board.
The independent claim 1 present in the application is
reproduced as follows:
1. A package for an integrated circuit having wires for
electrical connection, comprising:
a circuit board for mounting the integrated circuit having a
first surface and a second surface;
a connector device positioned on the first surface of the
circuit board for electrically connecting the integrated circuit
by said wires;
said integrated circuit being positioned on the second
surface of said circuit board; and
said wires being centrally positioned on said integrated
circuit to abut said first surface of the circuit board.
References
The references relied on by the Examiner are as follows:
King et al. (King) 5,677,566 Oct. 14, 1997
(filed May 8, 1995)
Kata et al. (Kata) 5,683,942 Nov. 4, 1997
(filed May 25, 1995)
Nakamura et al. (Nakamura) 5,777,391 Jul. 7, 1998
(filed Dec. 11, 1995)
2
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