Appeal No. 2003-0272
Application No. 09/478,497
BACKGROUND
The invention relates to a technique for measuring the quality of an electronic
assembly soldering process. A printed circuit board test vehicle is provided, which has
structure for receiving surface mounted replicas of integrated circuit packages. Claim 7
is reproduced below.
7. A method of testing an electronic assembly manufacturing process
comprising:
preparing a circuit board test vehicle for said manufacturing process, said
circuit board having at least one interleaved circuit pattern having first and
second ends which terminate in first and second holes in said circuit board;
attaching a replica component to circuit pads which extend about the edge of
said circuit pattern through said manufacturing process; and
measuring the resistance between said first and second ends of said circuit
pattern following said attachment of said replica component.
The examiner relies on the following references:
Peterson et al. (Peterson) 5,552,567 Sep. 3, 1996
Bardsley et al. (Bardsley) 5,754,410 May 19, 1998
(filed Sep. 11, 1996)
Claims 7-10 stand rejected under 35 U.S.C. § 103 as being unpatentable over
Peterson and Bardsley.
An earlier rejection under 35 U.S.C. § 112 has been expressly withdrawn by the
examiner.
We refer to the Final Rejection (Paper No. 7) and the Examiner’s Answer (Paper
No. 14) for a statement of the examiner’s position and to the Brief (Paper No. 13) and
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