Appeal No. 2003-1331
Application 09/301,889
definite, sustained shape, and then substantially flattening the top surface of each of such formed
solder bumps with a platen. Appealed independent claim 23 contains similar language.
Thus, we agree with appellants that Lin, in using flat disk 50 to force conductive paste 30,
which can be a solder paste, into openings 20 on top of bond pads 12 as well as to remove excess
paste 30 as shown in Lin FIG 4 (col. 3, lines 61-67, and col. 4, line 25), does not first form a
solder bump and then flatten that solder bump with a platen, that is, form a flat surface on a
solder bump, but rather forces solder paste into a specific space to form a solder bump with a flat
surface. Compare the solder bumps prepared by the Lin methods as illustrated by Lin FIGs. 4
and 7, with the solder bumps modified by the claimed method as illustrated in the specification
Figs.
Accordingly, because the applied prior art would not have led one of ordinary skill in this
art to the claimed method as a whole, we reverse all of the grounds of rejection.
The examiner’s decision is reversed.
Reversed
CHARLES F. WARREN )
Administrative Patent Judge )
)
)
)
PAUL LIEBERMAN ) BOARD OF PATENT
Administrative Patent Judge ) APPEALS AND
) INTERFERENCES
)
)
BEVERLY A. PAWLIKOWSKI )
Administrative Patent Judge )
Randy W. Tung
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