Appeal No. 2004-0022
Application No. 09/734,807
at least one contact hole (6) which passes through the
module and
a structured metallization which covers the module and the
contact hole (6)
The examiner relies upon the following references as
evidence of obviousness:
Lewis 1,580,057 Apr. 6, 1926
Ohyama et al. (Ohyama) 4,437,140 Mar. 13, 1984
Guertin 4,470,096 Sep. 4, 1984
Pedder 5,604,658 Feb. 18, 1997
McMillan et al. (McMillan) 6,297,458 Oct. 2, 2001
(Feb. 11, 1997)
Appellants' claimed invention is directed to a module having
a thin-film circuit on an insulating substrate. The module
includes a passive component having at least a first and second
electrically conducting layer and a dielectric layer, wherein at
least one of the conducting layers has a structured surface with
recesses. The recesses "have the result that the passive
component is composed of various capacitors connected in
parallel," which result in the capacitance of the passive
component being equal to the sum of the capacitance values of the
parallel capacitors (page 2 of Brief, last paragraph).
Appealed claim 1 stands rejected under 35 U.S.C. § 103 as
being unpatentable over Ohyama in view Guertin. Claims 2 and 3
stand rejected under 35 U.S.C. § 103 as being unpatentable over
Ohyama in view of Guertin and Lewis, whereas claim 4 stands
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