Appeal No. 2003-0270
Application 09/087,234
Rejection over Kondo
Kondo discloses a dielectric structure (col. 1, lines 9-11)
having a 15 :m thick dense layer (1b) above a 250 :m thick
porous layer (col. 5, lines 3-7). The layers are bonded together
with a non-deteriorating bond formed by heat treating and
sintering (col. 3, lines 6-7; col. 4, line 55 - col. 5, line 2).
The porous layer is formed from a slurry containing carbon powder
which oxidizes out of the material to form pores which are closed
by sintering (col. 3, lines 46 and 56-63; col. 4, lines 12-15).
The slurry used to form the dense layer differs from that used to
form the porous layer only in that it does not contain carbon
(col. 4, lines 43-45). The porosities of the dense layer and the
multilayer substrate are, respectively, 1% and 60% (col. 5,
lines 14-17). Thus, Kondo indicates that the pores in the dense
layer, formed in the absence of carbon powder, are much smaller
than the pores in the porous layer. This indication that the
pores in the dense layer are much smaller than those in the
porous layer, together with the teachings that the multilayer
substrate’s average pore size is 10 :m or less, more preferably
3 :m or less (col. 2, line 64 - col. 3, line 3), the thickness
of the dense layer is 15 :m (col. 5, line 7), and the porous
layer is 16.7 times thicker than the dense layer (col. 5,
-5-5
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