Appeal No. 2003-2021 Page 2
Application No. 09/753,703
electromagnetic radiation and is not ohmically conductive (Brief,
page 2). Independent claim 5 is illustrative of the invention
and is reproduced below:
5. A method of containing electromagnetic radiation,
comprising:
filling a gap between a heat sink mounted on an integrated
circuit package and a printed circuit board with a material that
absorbs electromagnetic radiation, and wherein said material is
not ohmically conductive.
The claims on appeal stand rejected under 35 U.S.C. § 102(b)
as anticipated by Akram et al. (Akram), U.S. Patent No.
5,866,953, issued on Feb. 2, 1999 (Answer, page 4). We reverse
the examiner’s rejection on appeal essentially for the reasons
stated in the Brief, Reply Brief, and those reasons set forth
below.
OPINION
The examiner finds that, with regard to claim 5 on appeal,
Akram discloses in figure 4 filling a gap between a heat sink
(428) mounted on an integrated circuit package (402) and a
printed circuit board (416) with a material (424) that absorbs
electromagnetic radiation, and where the material is not
ohmically conductive (Answer, page 4). The examiner further
finds that Akram discloses urethane as a barrier glob top
material (424) and appellant discloses that urethane has the
property of absorbing electromagnetic radiation (Answer, page 6,
citing the specification, page 9, ll. 1-4). The examiner finds
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