Appeal No. 2004-0421
Application No. 09/749,923
BACKGROUND
Appellants’ invention is directed to a component of semiconductor processing
equipment that comprises a fullerene coating. According to Appellants, semiconductor
processing equipment includes components that are exposed to highly corrosive plasma
during semiconductor processing. (Brief, p. 2). Claims 12 and 22 which are
representative of the invention are reproduced below:
12. A component of semiconductor processing equipment comprising:
(a) a surface;
(b) an optional intermediate coating on said surface;
(c) an optional second intermediate coating on said first intermediate
coating or on said surface; and
(d) a fullerene containing coating on said component that forms an outer
corrosion resistant surface.
22. A component of semiconductor processing equipment having at least
one surface exposed to plasma in the equipment, the component
comprising a fullerene containing material forming a surface exposed to
plasma in the equipment.
CITED PRIOR ART
As evidence of unpatentability, the Examiner relies on the following prior art:
Fagan 5,382,719 Jan. 17, 1995
Holtkamp 5,704,613 Jan. 06, 1998
Appellants’ admission of the prior art in the specification, page 2, third paragraph of the
disclosure.
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