Appeal No. 2004-0648
Application No. 09/379,047
APPENDIX
1. A method for removing substrate from a semiconductor
chip having a circuit side including active circuitry and a back
side including silicon substrate, the method comprising removing
a portion of substrate in the back side of the semiconductor chip
as a function of photons emitted through substrate remaining at
the back side.
2. The method of claim 1, further comprising measuring the
photon emission strength by detecting the photons emitted through
the remaining substrate.
3. The method of claim 2, further comprising controlling
the substrate removal responsive to the measured photon emission
strength.
24. A method for removing substrate from a semiconductor
chip, the chip having a circuit side and a back side, the back
side having silicon substrate, the method comprising:
removing substrate from the back side of the semiconductor
chip;
measuring the photon emission strength of the chip; and
controlling the removal of substrate in response to a
measured photon emission strength.
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