Ex Parte Chung et al - Page 2




              Appeal No. 2005-0090                                                                                          
              Application No. 10/057,025                                                                                    


                     Appellants’ invention relates to an integrated micro-droplet generator.  An                            
              understanding of the invention can be derived from a reading of exemplary claim 11,                           
              which is reproduced below.                                                                                    

                     11.      A thermal bubble inkjet head having a symmetrical off-shooter                                 
                     heater comprising:                                                                                     
                             a silicon substrate having a top surface and a bottom surface;                                 
                             a first insulating material layer of at least 1000 D thick on said top                         
                     surface;                                                                                               
                             a funnel-shaped manifold formed in said silicon substrate;                                     
                             a symmetrical ring-shaped heater formed on said first insulating                               
                     material layer on said top surface;                                                                    
                             an interconnect formed of a conductive metal in electrical                                     
                     communication with said ring-shaped heater;                                                            
                             a second insulating material layer on top of said ring-shaped heater                           
                     and said first insulating material layer;                                                              
                             a first photoresist layer of at least 2000 D thick on top of said                              
                     second insulating material layer;                                                                      
                             an ink chamber formed in said first photoresist layer in fluid                                 
                     communication with said funnel-shaped manifold;                                                        
                             a metal seed layer on said first photoresist layer and an inkjet                               
                     orifice formed in said metal seed layer; and                                                           
                             a Ni layer on top of said metal seed layer with an aperture formed                             
                     therein in fluid communication with said inkjet orifice.                                               




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